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基于一S波段圆柱盒型输出窗的电磁仿真与高频介质损耗计算,结合ANSYS软件对窗片温度与热应力分布模拟,探讨高次模式对输出窗热损耗与耐热性能方面的影响。结果表明,存在于窗片表面的TM11模可能加剧输出窗的热损耗,增大窗片承受的温度梯度和热应力,从而导致输出窗的耐热性能与平均功率耐受能力下降。
Based on the electromagnetic simulation and high-frequency dielectric loss calculation of an S-band cylindrical box-type output window, the simulation of the temperature and thermal stress distribution in the window panel was carried out with ANSYS software to investigate the influence of the high-order mode on the heat loss and heat resistance of the output window. The results show that TM11 mode existing on the surface of the window sheet may exacerbate the heat loss of the output window and increase the temperature gradient and thermal stress that the window plate withstands, resulting in a decrease of the heat resistance and the average power tolerance of the output window.