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在铜线键合的过程中通入惰性保护气体,或在纯铜线表面涂覆金属钯防氧化层都可以改善铜线键合的抗氧化性能。为了评价上述两种方法对铜线键合抗氧化性能的改进情况,使用先进的材料表征方法分析不同保护气体流量情况下键合形成的金属熔球的形貌,金属熔球表面的氧原子数分数和表面氧化层的厚度。研究表明,保护气体流量为0.51 L/min时,可以在保证成本较低的情况下获得最佳的抗氧化效果。通过XPS和TEM分析发现,铜线表面涂覆金属钯可以延长铜线的存储寿命,降低键合界面的氧含量,提高键合的可靠性。
The introduction of an inert protective gas during copper bonding or the application of a metal palladium oxide layer on the surface of a pure copper wire can improve the oxidation resistance of copper wire bonding. In order to evaluate the improvement of the oxidation resistance of the copper wire bonded by the above two methods, the morphology of the molten metal balls formed by bonding under different shielding gas flows was analyzed using advanced material characterization methods. The number of oxygen atoms on the surface of the molten metal ball Fraction and surface oxide thickness. Studies have shown that when the shielding gas flow rate is 0.51 L / min, the best anti-oxidant effect can be obtained with low cost. XPS and TEM analysis showed that the copper coating on the copper surface can prolong the storage life of the copper wire, reduce the oxygen content of the bonding interface and improve the bonding reliability.