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A novel epoxy-imide resin based on diglycidyl ether of bisphenol-A and N-(4-hydroxyphenyl) terahydrophthalic anhydrideimide (HTAM) was synthesized. The structural characterization of the epoxy-imide resin was conducted by FT-IR spectra. 4,4\'-diaminodiphneylmethane (DDM) was used as a curing agent for the epoxy-imide resin. The thermal properties of the cured resin were evaluated with dynamic mechanical analyses (DMA) and thermogravimetric analysis (TGA). The results showed that the cured resin exhibited a high glass transition temperature (Tg) of 186 ℃ when the molar amount of HTAM was 0.04 mol in the resin. The yields of the cured resin at 800 ℃ raised from 16.45％ to 19.41％. The flexural properties were also measured, the flexural strength raised from 79.4 to 95.7 MPa, and the flexural modulus exhibited from 2.6 to 3.0 GPa.