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20 nm节点将是半导体产业生态圈的分水岭和转折点,它不仅带来半导体设备、光刻技术、封测技术等领域的诸多挑战,更对电子设计自动化(EDA)工具提出了革新性的需求。2013年28 nm芯片呈现爆发式增长,更有少数厂商将在2013年进入22 nm和20 nm时代。而先进工艺IP的移植及设计优化遇到的诸多挑战,随着制造工艺愈加复杂,尤其进入到纳米工艺制程,且新产品上市周期越来越短,如何提高设计移植效率,缩短设计周期
The 20-nm node will be a watershed and turning point in the semiconductor ecosystem. It not only presents many challenges in semiconductor equipment, lithography, packaging and testing technologies, but also presents innovative requirements for electronic design automation (EDA) tools. The 28 nm chip showed explosive growth in 2013, with a few more vendors entering the 22 nm and 20 nm era in 2013. However, the challenges encountered in the migration and design optimization of advanced process IP have become increasingly complicated as the manufacturing process becomes more complicated, especially into the nano process process, and the new product launch cycle becomes shorter and shorter. How to improve the design transfer efficiency and shorten the design cycle