石英玻璃与硅的飞秒激光微连接及其接头性能研究

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飞秒激光的低热输入、极小热影响区的特点使其在微纳米尺度材料连接领域有明显的优势。为了将石英玻璃与硅可靠地连接在一起,使用功率为4~30 m W,频率为1 k Hz,波长为800 nm的飞秒激光对石英玻璃与硅进行连接,测试了接头的剪切强度,对接头横截面进行腐蚀处理,观察截面,分析了接头断裂前后的形貌特征,研究了激光参数,如激光功率、扫描速度、聚焦物镜的数值孔径以及离焦量对接头强度的影响规律。实验结果表明,根据焊接工艺的不同,接头强度分布在7~54 MPa之间。将激光准确定位到界面处,在合适的激光功率和扫描速度下可以降低焊缝缺陷,得到剪切强度较高的接头。 Femtosecond laser heat input, the characteristics of a very small heat-affected zone in the field of micro-nano-scale materials have obvious advantages. In order to connect the quartz glass with the silicon reliably, the quartz glass and the silicon were connected by using a femtosecond laser with a power of 4-30 mW, a frequency of 1 k Hz and a wavelength of 800 nm, and the shear strength of the joint was tested , The cross section of the joint was etched, the cross section was observed, and the morphological characteristics before and after the fracture of the joint were analyzed. The influence of the laser parameters such as the laser power, the scanning speed, the numerical aperture of the focusing objective and the defocus amount on the strength of the joint was studied. Experimental results show that, according to the different welding process, the joint strength distribution between 7 ~ 54 MPa. Accurate positioning of the laser to the interface at the appropriate laser power and scanning speed can reduce the weld defects, resulting in higher shear strength joints.
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