在微电子生产进入深亚微米和纳米技术之后，空白硅晶圆材料正在承担起前所未有的角色来协助解决生产工艺和产品成本等关键问题。根据国际半导体技术路线图穴ITRS雪对空白晶圆关键物理參数的要求，探讨有关检测设备在提供晶圆表面局部平整度，nanotopography和表面COP缺陷等质量參数认证时所应具备的技术和能力。 After microelectronics enters deep-submicron and nanotechnology, blank silicon wafers are taking on unprecedented roles to help solve key issues such as manufacturing processes and product costs. According to the requirements of Cryogenic ITRS Snow on the key physical parameters of blank wafers in accordance with the international semiconductor technology roadmap, the technologies and techniques required for testing equipment to provide quality parameters such as local flatness on the wafer surface, nanotopography, and surface COP defects are discussed. ability.