台积电、三星、格罗方德等半导体大厂开启在7纳米制程争战,而现在台积电有望领先群雄在2017年国际固态电路研讨会(International Solid-State Circuits Conference,ISSCC)率先发布7纳米FinFET技术。全球IC设计领域论文发布最高指标国际固态电路研讨会(ISSCC)下届确定于2017年2月5~9日在美国加州登场,台积电设计暨技术平台组织副总侯永清将担任特邀报告(Plenary Talks)讲者。这次台积电5篇论文获选(美国台积电1篇),2篇论文为类比电路领域,内 Semiconductor manufacturers such as TSMC, Samsung and Groupe open their battle in the 7-nanometer process, and now TSMC is expected to lead the pack at the International Solid-State Circuits Conference (ISSCC) in 2017, the first release of the 7-nanometer FinFET technology. Global IC Design Papers Published the Highest Index International Solid State Circuits Conference (ISSCC) The next scheduled to be held February 5-9, 2017 in California, USA, TSMC Design and Technology Platforms Vice President Hou Yongqing will serve as guest speaker (Plenary Talks )Speaker. The 5 TSMC papers were selected (TSMC 1), 2 papers for the analog circuit field, within