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利用人体淋巴细胞和Hela细胞并经 10 0 μMH2 O2 诱导DNA损伤 ,然后分为对照组和实验组 ,后者补充 2 5 μl 1μg/ml的核酸内切酶Ⅲ。结果显示对照组淋巴细胞经 4h培养后DNA断裂损伤下降到 6 3 85 (专用单位 ) ;补充核酸内切酶Ⅲ的实验组DNA断裂损伤明显增加达到 16 1 93 (P <0 0 5 )。对照组Hela细胞培养 4h后DNA断裂损伤为 19,而实验组断裂损伤明显高于对照组达到 172 1(P <0 0 1)。提示实验组DNA断裂损伤的增高可能包括H2 O2 所致DNA直接断裂和核酸内切酶Ⅲ切除修复过程中所形成的修复性断裂两部分 ,反映了DNA总体损伤水平。
Human lymphocytes and Hela cells were used and DNA damage was induced by 10 μM H2O2. The cells were divided into control and experimental groups, which were supplemented with 25 μl of 1 μg / ml endonuclease Ⅲ. The results showed that DNA damage of lymphocytes in the control group decreased to 6 3 85 (dedicated unit) after 4 h culture. The DNA damage of the experimental group supplemented with endonuclease Ⅲ increased significantly to 16 1 93 (P 0 05). The DNA damage of Hela cells in control group was 19 after 4 hours of culture, but the damage in experimental group was significantly higher than that in control group (P <0.01). It is suggested that the increase of DNA damage in the experimental group may include the two parts of the reparative fracture formed during the DNA direct cleavage and the endonuclease Ⅲ resection and repair caused by H2O2, which reflects the overall level of DNA damage.