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以平均粒径10 μm高纯 Si 颗粒为增强体,以 Al-Si20为基体,采用挤压铸造专利技术制备体积分数为65%的高体积分数环保型 Sip/Al-Si20复合材料。试验结果表明:复合材料的铸态组织均匀、致密,没有明显的颗粒团聚和偏聚,也不存在微小的孔洞和明显的缺陷;Sip/Al-Si20是轻质(密度为2.4 g/cm~3)、低膨胀(7.77×10~(-6)/℃)、高导热(156.34 W/m·℃)复合材料,电导率为4.08 MS/m,具有较高的比模量和比强度,可以对其进行镀 Ni 和封装焊接,能较好的满足电子封装和热控器件的使用要求。
A high volume fraction environmentally friendly Sip / Al-Si20 composite with a volume fraction of 65% was prepared by extrusion casting patented technology with Al-Si20 as the matrix reinforced with 10μm high purity Si particles. The experimental results show that the as-cast microstructure of the composites is uniform and compact with no obvious agglomeration and segregation of particles and no tiny holes and obvious defects. Sip / Al-Si20 is light (density 2.4 g / cm ~ 3), low expansion (7.77 × 10 -6 / ℃) and high thermal conductivity (156.34 W / m · ℃), the conductivity was 4.08 MS / m and had higher specific modulus and specific strength. It can be Ni-plated and package welding, can better meet the requirements of electronic packaging and thermal control devices.