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分析了Ｓｉ３Ｎ４／４０Ｃｒ钢钎焊接头缓冲层机制。利用压力钎焊促进缓冲层产生塑性变形，降低了接头的残余应力，提高了接头强度。软性缓冲层Ｃｕ和Ｎｂ易于产生较大的塑性变形，接头强度有明显提高；硬性缓冲层Ｔａ不易产生塑性变形，接头强度无明显提高。缓冲层塑性变形愈大，接头强度愈高。使用Ｃｕ作缓冲层材料，当外加压力为２７ＭＰａ时，接头拉伸强度可达６２．３ＭＰａ。ＥＰＭＡ结果表明，在加压和无压状态下，接头中各元素在垂直界面方向上的总体分布不发生变化。加压可以减小接头钎缝宽度，控制接头间隙。压力钎焊也有助于其它异种材料的连接。
The buffer layer mechanism of Si3N4 / 40Cr steel brazed joint was analyzed. The use of pressure brazing to promote plastic deformation of the buffer layer, reducing the residual stress joints and improve the joint strength. Soft buffer Cu and Nb tend to produce large plastic deformation, joint strength has improved significantly; hard buffer layer Ta is not easy to produce plastic deformation, joint strength did not increase significantly. The greater the plastic deformation of the buffer layer, the higher the strength of the joint. Cu as a buffer layer material, when the applied pressure is 27MPa, the joint tensile strength of up to 62.3MPa. EPMA results show that under the conditions of pressure and no pressure, the overall distribution of each element in the joint perpendicular to the interface does not change. Pressure can reduce the width of the joint brazing seam, control joint gap. Pressure brazing also contributes to the joining of other dissimilar materials.