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本项目由Open-Silicon,GLOBALFOUNDRI ES和Amkor三家公司合作完成。两颗28nm的ARM处理器芯片,通过2.5D硅转接板实现集成。芯片的高性能集成通常由晶体管制程提高来实现,应用2.5D技术的Si P正成为传统芯片系统集成的有效替代。Open-Silicon负责芯片和硅转接板的设计,重点在于性能优化和成本降低。GLOBALFOUNDRI ES采用28nm超低能耗芯片工艺制造处理器芯片,而用65nm技术制造2.5D硅转接板。包括功耗优化和功能界面有效管理等概念得到验证。硅基板的高密度布线提供大量平行I/O,以实现高性能存储,并保持较低功耗。所开发的EDA设计参考流程可以用于优化2.5D设计。本文展示了如何将大颗芯片重新设计成较小的几颗芯片,通过2.5D硅转接板实现Si P系统集成,以降低成本,提高良率,增加设计灵活性和重复使用性,并减少开发风险。
This project was completed by three companies, Open-Silicon, GLOBALFOUNDRI ES and Amkor. Two 28nm ARM processor chips, integrated through 2.5D silicon adapter board. The high-performance integration of the chip is usually achieved by the transistor process to improve, Si P using 2.5D technology is becoming an effective alternative to the traditional chip system integration. Open-Silicon is responsible for the design of silicon and silicon adapter boards, with emphasis on performance optimization and cost reduction. GLOBALFOUNDRI ES uses 28nm ultra-low-power chip technology to manufacture the processor chip, and 65nm technology to create 2.5D silicon adapter board. Including concepts such as power optimization and effective management of the functional interface are validated. High-density silicon substrate wiring to provide a large number of parallel I / O for high-performance storage, and maintain lower power consumption. The developed EDA design reference flow can be used to optimize the 2.5D design. This article shows how to redesign large chips into smaller chips and integrate Si P systems with 2.5D silicon risers to reduce costs, improve yield, increase design flexibility and reusability, and reduce Develop risk.