2,2′-dipyridyl and thiourea were investigated in electroless Ni-Cu-P solution to improve the microstructure and reduce deposition rate. The electroless deposition rate decreases with the addition of 2,2′-dipyridyl and thiourea to the plating solution. The result shows that the two stabilizer coexistence exists to have a better stability alone than any one kind. The open circuit potential (OCP)-time curve was used to judge the initial rate for electroless Ni-Cu-P alloy on steel surface. The inducing time for reaching a steady OCP increased and the deposits become fine with the adding concentration of additives. When 2.5 mg·L-1 2,2′-dipyridyl and 0.25 mg·L-1 thiourea is added to the bath, the inducing time is 48 s. The effects enhance by using the two additives at the same time. AFM and optical microscopy studies show that the deposits from two additives bath are comparatively smoother with less nodular structure. 2,2'-dipyridyl and thiourea were investigated in electroless Ni-Cu-P solution to improve the microstructure and reduce deposition rate. The electroless deposition rate decreases with the addition of 2,2'-dipyridyl and thiourea to the plating solution. The result shows that the two stabilizer coexistence exists to have a better stability than any one kind. The open circuit potential (OCP) -time curve was used to judge the initial rate for electroless Ni-Cu-P alloy on steel surface. When 2.5 mg · L-1 2,2'-dipyridyl and 0.25 mg · L-1 thiourea was added to the bath, the inducing time is is 48 s. The effects enhance by using the two additives at the same time. AFM and optical microscopy studies show that the deposits from two additives bath are comparatively smoother with less nodular structure.