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为克服传统光学方法测量半导体激光阵列(LDA)Smile效应时存在的光学系统搭建精度要求高、测试人员素质要求高、后期数据处理繁杂测量时间长等缺点,通过用机械接触式台阶仪的探针扫描焊接后LDA芯片N面的方式,快速测量LDA的Smile效应,并将之与传统光学方法测量的Smile效应进行对比。结果表明,两者形态完全一致,差别小于1μm。用台阶仪测量LDA Smile效应耗时小于1 min。此方法能为芯片焊接工艺优化Smile效应提供快速反馈,可方便集成在大批量生产流水线中对LDA的Smile效应进行实时监测。
In order to overcome the shortcomings of traditional optics methods such as high accuracy of optical system, high quality of testers and complicated data processing in the later period when measuring the Smile effect of semiconductor laser array (LDA) After scanning the surface of the LDA chip N-plane, the Smile effect of the LDA was measured quickly and compared with the Smile effect measured by the conventional optical method. The results show that the morphology of the two is exactly the same, the difference is less than 1μm. Measuring the LDA Smile effect with a stepper takes less than 1 min. This method provides fast feedback for optimizing the Smile effect of the chip soldering process, allowing for easy integration into the LDA’s Smile effect in real-time monitoring in high volume production lines.