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应用最小能量原理和有限元方法 ,建立塑料球栅阵列 (PBGA:Plastic Ball Grid Array)器件焊点三维形态预测模型 ,对 PBGA焊点三维形态进行预测和分析 .并将预测结果与试验结果以及国外学者用数学分析模型所得到的预测结果进行了对比验证 ,具有很好的一致性
By using the principle of least energy and finite element method, the 3D shape prediction model of the solder ball of plastic ball grid array (PBGA) was established to predict and analyze the three-dimensional shape of PBGA solder joints. The prediction results and the experimental results, Scholars use the mathematical analysis model to predict the results obtained by the comparative verification, with good consistency