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倒装芯片(Flip-Chip,F-C)封装显示出比引线键合封装更好的热特性和电特性,并减小了形状因数。30多年前由 IBM 独创地引入的倒装芯片封装并不是一种新技术,但是直到最近,倒装芯片技术一直局限于高端器件和利基(niche)市场应用。而今,倒装芯片封装的需求开始增长,因为这种技术正在广阔的应用范围内被采纳,并拓宽了各种不同的封
Flip-Chip (F-C) packages show better thermal and electrical characteristics than wire-bond packages and reduce the form factor. Flip-chip packaging, originally introduced by IBM over 30 years ago, is not a new technology, but until recently flip-chip technology was limited to high-end devices and niche markets. Nowadays, the demand for flip-chip packaging has started to grow as the technology is being adopted in a wide range of applications and broadening the range of different packages