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以BCu68Zn钎料为研究对象,在其表面热浸镀锡,借助综合热分析仪、润湿试验炉、数字电流电桥等检测设备分析了Sn镀层对钎料熔化温度、铺展性能、电阻率的影响。结果表明:BCu68Zn钎料表面热浸镀Sn能显著降低其固相线和液相线温度;BCu68Zn钎料表面热浸镀Sn可显著提高其润湿性能,基体钎料的铺展面积为229.83 mm~2,而在热浸镀Sn含量为6.4%时,钎料的铺展面积可达到299.52mm~2;钎料电阻率达到7.33×10~(-8)Ω·m,稍高于基体钎料的电阻率6.67×10~(-8)Ω·m,表面热浸镀Sn层使钎料电阻率增大,导电性变弱。
With BCu68Zn solder as the research object, hot dip tinning was carried out on the surface of the brazing filler metal. The effects of Sn plating on the melting temperature, spreading performance and electrical resistivity of the brazing filler metal were analyzed by means of integrated thermal analyzer, wetting test furnace and digital current bridge. influences. The results show that the hot dip Sn plating on the surface of BCu68Zn solder can significantly reduce the solidus and liquidus temperature. The hot dip Sn plating on the surface of BCu68Zn solder can significantly improve the wettability. The spreading area of the substrate solder is 229.83 mm ~ 2, while the hot dip Sn content of 6.4%, the spreading area of the solder can reach 299.52mm ~ 2; solder resistivity of 7.33 × 10 ~ (-8) Ω · m, slightly higher than the matrix solder The resistivity is 6.67 × 10 ~ (-8) Ω · m. The surface hot-dip Sn layer increases the electrical resistivity of the solder and the electrical conductivity becomes weaker.