在半导体制造中,硅片上光致抗蚀剂涂层的厚度必须具有高度的均匀性和可重复性。最近,自旋涂胶机取得了一些进展,通过对自旋涂胶机的速度、加速度和光致抗蚀剂添加速率的精确控制,改进了涂层厚度的均匀性和可重复性。这些可变量中,涂层厚度在很大程度上依赖于排出气流的速率。典型生产中,由于中心排气系统负载的不断变化,排气速率将会出现较大的波动。在Teledyne半导体公司,改变自旋涂胶机的排气气流能使硅片上以及硅片间的光致抗 In semiconductor manufacturing, the thickness of photoresist coatings on silicon wafers must be highly uniform and repeatable. Recently, some advances have been made in spin-coaters to improve the uniformity and repeatability of coating thickness through precise control of spin-coater speed, acceleration, and photoresist addition rates. Of these variables, coating thickness is strongly dependent on the rate of exhaust gas flow. In a typical production, the exhaust gas rate will fluctuate significantly due to the changing load on the central exhaust system. At Teledyne Semiconductor, changing the exhaust gas flow from a spin coater enables the photo-resistance