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采用直流磁控溅射技术和光刻工艺制备了Cr/Cu/Ag/Cu/Cr复合薄膜及其电极,研究不同温度热处理对复合薄膜和电极结构、表面形貌和电性能的影响。Ag层与最外层的Cr层之间的Cu层不仅增强了Cr和Ag之间的粘附力,而且起到了牺牲层和氧气阻挡层的作用;Cr和Cu对Ag的双重保护使得薄膜电极在温度小于500℃时电阻率保持较为稳定,约为3.0×10-8~4.2×10-8Ω·m之间。然而由于电极表面氧化和边沿氧化的共同作用,薄膜电极的电阻率在热处理温度超过575℃出现了显著的上升。尽管如此,Cr/Cu/Ag/Cu/Cr薄膜电极仍然是一种能够承受高温热处理并且保持较低电阻率的新型电极,满足场发射平板显示器封接过程中的热处理要求。
The Cr / Cu / Ag / Cu / Cr composite films and their electrodes were prepared by DC magnetron sputtering and photolithography. The effects of heat treatment at different temperatures on the structure, surface morphology and electrical properties of the composite films and electrodes were investigated. The Cu layer between the Ag layer and the outermost Cr layer not only enhances the adhesion between Cr and Ag but also serves as a sacrificial layer and an oxygen barrier layer; the double protection of Cr and Cu against Ag allows the thin-film electrode When the temperature is less than 500 ℃, the resistivity is stable, about 3.0 × 10-8 ~ 4.2 × 10-8Ω · m. However, the resistivity of the thin film electrode increased significantly when the heat treatment temperature exceeded 575 ° C due to the combined effect of electrode surface oxidation and edge oxidation. Nevertheless, the Cr / Cu / Ag / Cu / Cr thin-film electrode is still a new type of electrode that can withstand high temperature heat treatment and maintain low resistivity to meet the heat treatment requirements of the field emission flat panel display.