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现阶段的光模块封装类型已从小型可插拔(SFP)系列逐渐向100Gb/s可插拔(CFP)系列和4通道SFP(QSFP)系列过渡,传输速率最高可达400Gb/s,发射端激光器消光比大于9dB,光波分复用器插入损耗小于1dB,发射功率大于0.3dBm,接收端探测器响应度为0.7A/W,接收灵敏度小于-17dBm。阐述了在数据中心光互连中可以应用于IEEE制定的40/100GbE标准802.3ba的发射和接收集成芯片,主要包括分立器件组装芯片、混合集成芯片和单片集成芯片,介绍了其各种类型的基本结构和特性。
At this stage, the optical module package types have been gradually transitioning from the SFP series to the 100Gb / s CFP series and the 4-channel SFP (QSFP) series with transmission rates up to 400Gb / s. The transmitter Laser extinction ratio greater than 9dB, WDM insertion loss less than 1dB, transmit power greater than 0.3dBm, the receiver response of 0.7A / W, receiver sensitivity is less than-17dBm. In the optical interconnection of data center, the article describes the integrated transmitting and receiving integrated chip of 40 / 100GbE standard 802.3ba which is made by IEEE, including discrete device assembly chip, hybrid integrated chip and monolithic integrated chip, The basic structure and characteristics.