前言电子产品能够如此高速的发展,原因是多方面的。产品设计、材料开发、元器件研制、生产工艺及设备的更新、尤其是各种自动装联焊接设备的进步,乃是不可缺少的重要因素。今天,半导体技术已进入大规模集成电路的研制发展阶段,产品的组装密度继续提高,对自动焊接设备提出了更高的要求,所以,自动焊接设备的更新、配套设备的完善、工艺水平的提 Foreword Electronic products can so fast development, for many reasons. Product design, material development, component development, production technology and equipment updates, especially the progress of various automatic welding equipment, is an indispensable and important factor. Today, the semiconductor technology has entered the stage of development and development of large scale integrated circuits, product packaging density continues to increase, automatic welding equipment put forward higher requirements, therefore, automatic welding equipment updates, equipment improvements, improve the level of technology