As semiconductor devices are scaled down,Cu interconnects become the best way due to its good electromigration resistance,and low electrical resistivity (1.67μΩ cm).
Nickel thin films were deposited by plasma-enhanced atomic layer deposition (PE-ALD) by using metallorganic precursors and various reactant gases,H2 and NH3,including its plasma.
For the various electronic devices such as microelectromechanical system (MEMS) devices,thin film transistor-liquid crystal display (TFT-LCD) devices,flexible display devices,etc.,dielectric thin film
Recently,technology development has emerged for low-cost and high-performance multi-axis sensor using polymer.Especially,NBR is one of primary materials because it has high dielectric property.
We synthesized uniform 6 nm sized spherical PbS quantum dots using lead chloride and elemental sulfur.Compared to other methods,this synthesis has certain advantages such as low cost and multigram sca
Mass spectrometry was applied as in situ process diagnostics during deposition of silicon thin films.By measuring the silane concentration in plasma region,the transient depletion of silane at the beg
A magnetic abrasive finishing process is a method of non-traditional precision machining in which the finishing process is completed using magnetic force and magnetic abrasives.