Thermal Analysis on Spring Contacts of High Voltage Apparatus

来源 :第十三届国际机电装置会议(IS-EMD2013) | 被引量 : 0次 | 上传用户:kxdn01
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  The thermal phenomena of the spring contacts in high-voltage apparatus is studied.An experimental circuit is built to conduct AC and DC steady-state temperature rise test with the spring contacts as the core unit.For this prototype, a thermal simulation method is provided based on analyzing the principles of heat generation and transfer.By comparing the results of simulation and experiment under different current levels, the effectiveness of simulation method is verified, provid ing reference for further temperature rise test and design of contact fingers.
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