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Integrated Circuits (ICs) integrate individual transistors, resistors, and capacitors etc.into one chip, resulting in high performance/cost since integration enables ICs to perform more functions per area, reduces the cost with high precise fabrication in parallel, enhances the reliability of IC systems with greatly reducing wires and pads.MEMS originates from the same idea with ICs by integrating microsensors, microactuators, micromachines, microstructures, and circuits, etc into one system, with the help of the well-established IC infrastructures.The portable products such as iPhone and iPads are changing our dailys life.These contain microphones, gyros, accelerometers, magnetic sensors, oscillators, etc.which are milestone products during the progress of MEMS.Internet o f Things (loT) is a promising paradigm.The sensor is main parts for IoT.MEMS, as one of core technologies of IoT, may support a $Trillion chains of IoT with low cost, low power dissipation, high performance, multi-functions, intelligent micro/nano systems.Only integration approach, can such systems be possible.The integration can be completed at the wafer level, at the package level, or at the board level.This report will address the research and development of the 3D integration for the micro/nano systems, and the progress of related technologies in China.