Effect of dc sputtering parameter of molybdenum on galvanic reaction between molybdenum and copper t

来源 :2011年第三届微电子及等离子体技术国际会议 | 被引量 : 0次 | 上传用户：liongliong542

【摘要】

：

Molybdenum and its alloys are extensively utilized in thin film transistor industry for copper metallization because of their high thermal stability,good electrical conductivity and adhesion with glas

【作者】

：

Bo-Hyun Seo Sang-Hyuk Lee In-sun Park Jong Hyun Seo

【机构】

：

Dept. of Materials Engineering, Korea Aerospace University,200-1 Hwajeon-dong, Deogyang-gu, Goyang 4

【出处】

：

2011年第三届微电子及等离子体技术国际会议

【发表日期】

：

2011年9期

【关键词】

：

Molybdenum Copper Thin Films Galvanic Reaction Residual Stress

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Effect of dc sputtering parameter of molybdenum on galvanic reaction between molybdenum and copper t

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