论文部分内容阅读
激光扫描声学显微镜是一种新型的集成电路引线焊接无损检测技术。本文分析了该技术用于集成电路引线焊接测量的一些设计参数和技术指标 ,阐述了实验系统 ,最后给出了一些集成电路样品的实验结果
Laser Scanning Acoustic Microscopy is a new type of integrated circuit lead bonding non-destructive testing technique. This paper analyzes some of the design parameters and technical specifications of this technology used in the lead soldering measurement of the integrated circuit, expounds the experimental system, and finally gives the experimental results of some integrated circuit samples