论文部分内容阅读
Cell adhesion is one of the essential factors for surviving and displaying their functions[1].Thus,monitoring of cell adhesion appears especially important.Electric cell-substrate impedance sensing (ECIS) developed by Giaever and Keese is a favored label-free,noninvasive and real-time technology for the monitoring and analysis of cell behaviors[2].Compared with the common microelectrodes made of noble metals for ECIS,indium tin oxide (ITO) microelectrodes can realize the real-time observation of cell morphology,due to their both transparent and conductive properties[3].In this work,ITO microelectrodes array is developed with photolithography for the monitoring of SHSY-5Y cell adhesion using ECIS.It has 3×3 micropores with 50 μm in diameter and 100 μm in period.SH-SY5Y cells with two seeding densities were cultured on ITO microelectrodes array and the impedance signals were collected every 0.5 h after cell seeding.The results indicate clearly that cells in different stages of adhesion have different impedance responses.In general,the impedance values increase,because more and more electrode surface is covered by cells.The seeding density could not influence the variation trend,but could result in the different variation rate.Moreover,due to the transparency of ITO microelectrodes array,cell morphology could be observed simultaneously,and a good correlation is found between changes in cell morphology and impedance values.This work is helpful for the establishing of correlations between electrical and biological characteristics of cells,which will accelerate undoubtedly the development of tissue engineering,implantology and regenerative medicine.