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针对MEMS热膜式传感器的发展趋势和在实用化过程中存在的问题,提出了一种新型的单片电路和体硅MEMS热膜式传感器实现集成制造的嵌入式CMOS工艺技术,解决了MEMS制造工艺和CMOS集成电路工艺之间存在的兼容性问题。通过这种嵌入式CMOS工艺技术,可以实现具备最小体积、最低成本的MEMS器件。通过这种嵌入式热膜式传感器和CMOS处理电路的单片集成制造工艺,实现了一款热膜式传感器和IC放大电路的集成部件,并完成了相关基本电性能测试和传感器功能的演示验证,证明了设计的工艺路线的可行性。
In view of the development tendency of MEMS thermal film sensor and its problems in practical application, a new type of embedded CMOS process technology for integrated manufacturing of monolithic circuit and bulk silicon MEMS thermal film sensor is proposed, which solves the problems of MEMS manufacturing Compatibility issues between process and CMOS integrated circuit technology. With this embedded CMOS process technology, MEMS devices with the smallest size and lowest cost can be realized. Through this embedded thermal film sensor and CMOS processing circuit monolithic integrated manufacturing process, to achieve a hot film sensor and IC amplifier circuit integrated components, and completed the relevant basic electrical performance testing and sensor function demonstration , Proved the feasibility of the design process route.