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With CuMn alloy as interlayer, the transient liquid phase (TLP) diffusion bonding of Cu alloys (CuAlBe) to stainless steel (1Cr18Ni9Ti) was studied. The results show that the bonding pressure, time and temperature and the content of Mn in CuMn alloy have great effects on the strength of bonding interface; when they are 1 MPa, 40 min, 1 223 K and 30% respectively, the maximum joint strength of 487 MPa is attained. The fracture occurring at the bonding interface is a plastic one and the effect of Mn has been analyzed.
The results show that the bonding pressure, time and temperature and the content of Mn in CuMn alloy have (TLB) diffusion bonding of Cu alloys (CuAlBe) to stainless steel (1Cr18Ni9Ti) was studied. great effects on the strength of bonding interface; when they are 1 MPa, 40 min, 1 223 K and 30% respectively, the maximum joint strength of 487 MPa is attained. The fracture occurring at the bonding interface is a plastic one and the effect of Mn has been analyzed.