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以2-苯基咪唑(2PZ)为芯材,聚甲基丙烯酸缩水甘油酯(PGMA)为壁材,采用溶剂挥发技术,成功地制备了一种新型潜伏性热释放型微胶囊固化剂2PZ-PGMA。通过FT-IR、TGA、SEM、粒度分析和DSC对微胶囊固化剂的化学结构、芯材含量、表面形貌、粒径分布及固化性能等进行了表征。所制备的微胶囊固化剂表面光滑,粒径分布较窄,平均粒径为约17.6μm,壁材厚度为约1.1μm,芯材2PZ含量为20.1(wt)%。由微胶囊固化剂与环氧树脂E-51制备的单组分胶粘剂,具有优良的固化特性、潜伏性能和粘接性能,可在100℃下30min内实现固化,室温储存期达33d以上,拉伸剪切强度达15.36MPa。
A novel latent heat-releasing microcapsule curing agent 2PZ-2 was successfully prepared by using 2-phenylimidazole (2PZ) as core material and polyglycidylmethacrylate (PGMA) as the wall material. PGMA. The chemical structure, core content, surface morphology, particle size distribution and curing properties of microcapsule curing agent were characterized by FT-IR, TGA, SEM, particle size analysis and DSC. The prepared microcapsule curing agent has a smooth surface, a narrow particle size distribution, an average particle diameter of about 17.6 μm, a wall thickness of about 1.1 μm, and a core material 2PZ content of 20.1% by weight. The one-component adhesive prepared by microcapsule curing agent and epoxy resin E-51 has excellent curing property, latent property and adhesive property. It can be cured within 30 minutes at 100 ℃ and stored at room temperature for more than 33 days. Tensile shear strength of 15.36MPa.