系统研究了以三乙醇胺(TEA)为主络合剂、EDTA·2Na盐为辅络合剂的二次镀铜体系。实验结果表明镀速随EDTA·2Na盐浓度增加而减慢,随TEA浓度、硫酸铜浓度、甲醛浓度、溶液pH值和镀液温度的增加而加快;添加剂亚铁氰化钾、α。α′-联吡啶和2-MBT均能使镀速减慢且浓度较低时均能使镀层外观变好;PEG-1000对镀速影响较小,但能使镀层质量变好。其二次化学镀铜最佳条件是:CuSO4·5H2O为16g/L,EDTA·2Na盐为6g/L,TEA为21·5g/L,pH值为12·75,甲醛(37%~40%)为16ml/L,亚铁氰化钾为100mg/L,α,α′-联吡啶为20mg/L,PEG-1000为1g/L,2-MBT为0·5mg/L及镀液温度为50℃。在最佳条件下镀速达到10·57μm/h,SEM分析镀层表面光滑、结晶均匀。 The secondary copper plating system with triethanolamine (TEA) as main complexing agent and EDTA · 2Na salt as secondary complexing agent was systematically studied. The experimental results showed that the plating rate slowed down with the increase of EDTA · 2Na salt concentration and accelerated with the increase of TEA concentration, copper sulfate concentration, formaldehyde concentration, solution pH and bath temperature. The additive potassium ferrocyanide, α Both α'-dipyridyl and 2-MBT can make the plating speed slow down and make the appearance of the coating better when the concentration is lower; PEG-1000 has little influence on the plating speed, but can make the coating quality better. The optimum conditions for the second electroless copper plating are: CuSO4 · 5H2O 16g / L, EDTA · 2Na salt 6g / L, TEA 21.5g / L, pH 12.75, formaldehyde (37-40% ) Was 16 ml / L, potassium ferrocyanide was 100 mg / L, α, α'-dipyridyl was 20 mg / L, PEG-1000 was 1 g / L and 2-MBT was 0.5 mg / 50 ° C. Under the optimum conditions, the deposition rate reached 10 · 57μm / h. SEM analysis showed that the surface of the coating was smooth and the crystallization was even.